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Description
Solder Wire Form Flux-Cored Wire Material Composition 96.
5 Percent Tin 3 Percent Silver 0.
5 Percent Copper Wire Diameter 0.
8 mm Weight 500 g Melting Temperature (Minimum) 422 Degrees F Melting Temperature (Maximum) 430 Degrees F Flux Type No-Clean Flux Classification ROM1 Solder Series SAC M1 For Joining Metal Application High Soldering Temperature Container Type Spool
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Processing Time:
2-3 days
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