Report item
Description
TECHSPRAY 1978-DP - SILICONE-FREE HEAT SINK COMPOUND - SILICONE-FREE HEAT SINK COMPOUND SIZE 4 OZ.
APPLICATION IN ELECTRONICS HEAT SINK COMPOUND IS USED TO THERMALLY BOND A COMPONENT AND A MECHANICAL HEAT SINK EFFICIENT COOLING - EQUAL TO G7453546
Features
Extra Information
Mandatory & Preferred Sources:
- Made in the USA
Specs
Manufacturer Name:
TECHSPRAY
Manufacturer Part Number:
1978-DP
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